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TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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Engineering & Design Services

Mistakes are expensive. Proof of design that evolves to an unsustainable full concept is disastrous. Our customers capitalize upon TTM's breadth of engineering experience across the product life cycle. Our integrated engineering teams work to provide a complete picture of your product, from the testing of your vision through dependable full-scale production. They are not experts on your product, you are. They are experts on printed circuit board manufacturing, making them an invaluable resource in your pursuit of innovative interconnect solutions.

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Engineering and Design Capabilities

Signal Integrity Assurance

  • Channel Simulation (Driver to Receiver)
    • HFSS
  • Signal Characterization
    • Sonnet
    • Polar
  • Power / Thermal Analysis
    • TASPCB (Iceboard)

PCB Design Layout

  • Schematic Capture
    • Orcad (Cadence)
    • DX Designer (Mentor)
  • Rigid PCB & Flex Circuit Layout
    • Allegro (Cadence)
    • Xpedition (Mentor)
    • Boardstation (Mentor)
    • Altium Designer

Electro-Mechanical Design

  • Mechanical Design
    • SolidWorks Premium (Dassault)
    • Creo (PTC)
  • Wiring Design & Interconnect
    • Solidworks Electrical
  • DFM & DFMA Optimization

Applications of Design Services

Conceptualization

  • Product Configuration & Definition
  • Interconnect Selection
  • Preliminary Design/Feasibility Analysis

New Design

  • Backplane/Midplanes
  • Flex & Rigid-Flex PWBs
  • Passive RF/Microwave PWBs
  • CCAs/Daughtercards
  • Chassis/Enclosures

Redesign/Value Engineering

  • Cost Reduction
  • DFM/DFT/DFMA Refinement
  • Reliability Improvement
  • Weight Reduction
  • Performance Enhancement

Standards Based Platforms

  • VME/VME64x
  • VITA 46 (VPX)
  • compactPCI
  • xTCA
  • ARINC 404/600
  • IEEE 1101.x
Signal Integrity Assurance

Signal Integrity Assurance


PCB Design Layout

PCB Design Layout


Electro Mechanical Design

Electro Mechanical Design


New Design

New Design


Redesign Value Engineering

Redesign Value Engineering


Standard Based Platforms

Standard Based Platforms


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