TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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IC Substrates

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution.

IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. TTM produces many types of IC substrates on which IC chip(s) are attached to the IC substrate utilizing wire bonding and, or flip chip methods. Advanced technology IC substrates that TTM manufactures include:

  • CSP (Chip Scale Packages)
  • FC-CSP (Flip Chip) CSP
  • BOC (Board on Chip)
  • PoP (Package on Package)
  • PiP (Package in Package)
  • SiP (System in Package)
  • RF Module
  • LED Package

Advanced Capabilities:

  • Minimum line width and spacing: 20/20 µm
  • Minimum laser via/pad: 45/95 µm
  • Bump pad: minimum 150 µm bump pitch
  • Bump material: SAC305
  • Structure: any layer, coreless, cavity, embedded passive, embedded circuit
  • Wide material and surface finish options available
  • Ultrathin board capability:

    Thin board layers Thickness capability/(mm) Remark
    Min. (2L) 0.11+/-0.02 Core Type
    Min. (3L) 0.12+/-0.02 Coreless Type
    Min. (4L) 0.15+/-0.02 Core Type
    Min. (6L) 0.18+/-0.02 Core Type
    Min. (8L) 0.22+/-0.03 Coreless Type
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