TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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Conventional PCBs

Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

  • Multilayer up to 60+ layers
  • Wide range of laminate options including high temperature, low loss and lead-free laminates
  • Mixed dielectric (hybrid) constructions
  • Panel size up to 30"x 55"
  • Embedded coin, or metal core and metal backed MLB
  • Panel thickness up to .450"
  • RF and microwave circuits
  • Heavy copper (10 oz. outer layer / 5 oz.
    inner layer)
  • Embedded, distributed and discrete passive components
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